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SonxSYS - MS Ultrasonic - WTP Ultrasonic


The requirements placed on product packaging are constantly changing and increasing. High-quality packaging must be functional and visually impeccable. At the same time, food packaging in particular must be hygienic and stable in shape – to name just a few crucial properties of packaging in the food industry. The challenge for the manufacturer is to produce these packages economically and efficiently while maintaining the flexibility of adaptation.
Our MS sonxSYS ultrasonic systems meet exactly these requirements. They were developed as modular solutions for specific packaging applications that can be easily and accurately integrated into new systems or existing concepts.
Comprised of our MS sonxCOM components “Made by MS Ultrasonic Technology Group”, our MS sonxSYS ultrasonic systems combine excellent product features, the expertise of our development engineers, and our extensive experience in the packaging industry. All these elements combine to produce reliable and cost-effective ​​ systems for sealing, welding, punching, cutting, and edge fiber welding.



The benefits of the ultrasonic welding process and the properties of our MS sonxSYS ultrasonic systems at a glance:

  • Sealed packaging;

  • Reduced bounce rates;

  • Sealing even with contamination;

  • Higher productivity due to short sealing times, and high process speeds;

  • Process reliability through traceability and quality assurance based on physical metrics;

  • Low energy consumption (approx. 80% less than the thermal seal);

  • Product-friendly processing using cold tools;

  • Instant availability at startup; immediate access at the stop;

  • Saves packaging materials thanks to thinner seams and free space savings.



  • Trouble-free sealing even with new film laminates (mono-multi-layer) by 2019 packaging regulations;

  • The compact size of the system;

  • Robust systems with a long service life;

  • Fast and simple integration into new or existing systems;

  • Proven technology and extensive experience in the fields of series machines and automation;

  • Configured to suit the specific application;

  • Simple and user-friendly operation;

  • Ultrasonic Components “Made by MS Ultrasonic Technology”.


We offer the following application-specific ultrasonic components.

SonxSYS - MS Ultrasonic - WTP Ultrasonic
Logo MS UltrasonicWTP Ultrasonic, gerador de solda ultrassom, termoplásticos, solda de termoplásticos, indústria do plástico, solda por vibração, solda por ultrassom, solda infravermelho, solda infrastake, solda spin, automação, NR12, adequação NR12, sonotrodo 20kHz, sonotrodo 35kHz, SonxCOM, SOnxSYS, SOnxTOP, MS Ultrasonic, Cemas do Brasil, Sonotronic, LSControl, KLM do Brasil, Weldplas, Sonitron.
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